Chip on Board and Wire Bonding Applications Wire bonding is a standard electrical interconnect technology used in assembling the vast majority of semiconductor packages. It is also a cost-effective and flexible method for attaching a ‘chip-on-board’ directly to a PCB assembly, providing various advantages over using regular ICs. With a broad experience in utilizing wire…
Vibration Analysis for Predictive Maintenance of Manufacturing Equipment As the modern-day business environment gets increasingly competitive and new disruptive technologies enter the scene, manufacturers are facing the need to maximize productivity and minimize machinery and equipment maintenance costs. The ability to identify machine defects before they cause failures, resulting in unplanned downtime and production losses,…
COM-HPC: New Standard Empowers Embedded Systems The embedded computing industry has recently (in the early 2021) approved COM-HPC (short for computer-on-module (COM) – high performance compute (HPC)) as the next-generation standard for modular system designs. It promises to boost the power and capabilities of edge computing and introduce a selection of new applications for COM-HPC…
Replicated Memory for Industrial and Real-Time Systems Today, in the era of rapid automation, real-time data collection and transmission is essential to the function of various systems and applications even the shortest delays are not acceptable as they can cause errors and interruptions of other processes. Complex industrial automation applications operating in parallel exchange…
Optimizing Machine Vision with Stereo Cameras and Time of Flight Sensors The physical world is three-dimensional and Artificial Intelligence (AI) relies on the input of vision systems to make decisions. Stereo vision camera systems deploy two or more lenses to make it possible to perceive depth by analyzing the deformation in the image. Time of…
Advantages in Machine Vision on the Edge Efficiency of Artificial intelligence (AI) utilizing vision systems to manage autonomous vehicles and robots is at the core of well designed unmanned system. Putting that AI processing close to the machine vision cameras and time-of-flight sensors, offers a breakthrough for a wide range of manufacturing and logistics applications. …
System Module Choices What are SiP, SoC, COM, and SOM devices and what are the pros and cons of each? What is the best fit for each module and how do they compare to the more traditional ‘chip down’ approach? In this post, we will take a short walk through each type, give product example…
I/O Centric System Design System architectures are fundamentally about receiving input data, processing it and outputting the processed data to another system or HMI (human machine interface). Product developers look for commercially available hardware platforms to reduce their development time and costs. However, many of the standard hardware products available are processor centric (CPU/NPU/GPU)…
Design Outsourcing Consumers in all industries are looking for solutions that exactly fit their requirements and turning away from standard products that are intended for a broad market. Product companies who wish to control their product design cycle, delivery commitments and safeguard their Intellectual Property may conclude that their only viable solution is to manage…