A high-performance COM-HPC server module featuring a large aluminum heat sink with a cooling fan, surrounded by eight vertical RAM sticks (DIMMs) on a green printed circuit board (PCB) designed for industrial embedded computing.

COM-HPC: New Standard Empowers Embedded Systems

COM-HPC: New Standard Empowers Embedded Systems The embedded computing industry has recently (in the early 2021) approved COM-HPC (short for computer-on-module (COM) – high performance compute (HPC)) as the next-generation standard for modular system designs. It promises to boost the power and capabilities of edge computing and introduce a selection of new applications for COM-HPC…